Semiconductor pressure sensor having a flange surface configured

Measuring and testing – Fluid pressure gauge – Electrical

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Details

73706, G01L 900, G01L 916, G01L 700

Patent

active

060620897

ABSTRACT:
The pressure sensor is simplified in structure and its assembled state to the housing body is made more compact. In the semiconductor pressure sensor for detecting pressure of a pressure medium, the semiconductor pressure sensor has a semiconductor sensor element for pressure detection supported by a sensor body via a pedestal seat and is assembled to a housing body that partitions the pressure medium and outside from each other. The sensor body is formed into a plate shape of a specified thickness having a flange portion, where the pedestal seat for joining and supporting the semiconductor sensor element and an adjustment circuit board for the semiconductor sensor element are joined on one surface side of the sensor body. The sensor body is fixed by being inserted into a stepped through hole provided in the housing body.

REFERENCES:
patent: 4563697 (1986-01-01), Miura
patent: 4771639 (1988-09-01), Saigusa et al.
patent: 5207102 (1993-05-01), Takahashi et al.
patent: 5625151 (1997-04-01), Yamaguchi
patent: 5783750 (1998-07-01), Otani
patent: 5859759 (1999-01-01), Moriyama et al.

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