Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
1999-05-18
2001-09-04
Young, Lee (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S739000, C029S740000, C029S743000, C029S707000, C029SDIG004, C318S135000, C310S012060, C901S040000, C294S064200, C414S737000, C414S751100, C414S752100
Reexamination Certificate
active
06282779
ABSTRACT:
TECHNICAL FIELD
The present invention relates to an apparatus and a method for mounting components such as electronic components, mechanism components, etc. onto members to be mounted, e.g., boards, etc.
BACKGROUND ART
A conventional mounting apparatus for electronic components of the above-referenced type will be described with reference to the drawings.
FIG. 3
is a perspective view schematically showing an essential portion of a generally used mounting apparatus for electronic components. In the drawing, reference numerals respectively indicate:
1
a controller,
2
an operation panel,
3
a component feed cassette,
4
a board,
5
a nozzle,
6
a head part having the nozzle
5
,
7
an XY robot,
8
an electronic component,
9
an XY table, and
19
a head part-supporting part for moving the head part
6
up and down and also moving in XY directions with the use of the XY robot
7
. In the constitution of the conventional mounting apparatus, each part of the apparatus operates in a manner as follows. Specifically, the head part
6
having the nozzle
5
at the head part-supporting part
19
which is positioned by the XY robot
7
sucks the to-be-mounted electronic component
8
by the nozzle
5
from the component feed cassette
3
, moves in the XY directions thereby carrying the component
8
sucked by the nozzle
5
to a mounting position, and lowers and mounts the component to a predetermined position of the board
4
securely held at the XY table
9
. At the time of lowering the electronic component
8
, a descent distance is set to a value obtained by subtracting a thickness of the electronic component
8
from a reference descent stroke and adding a push-in amount of a constant value to the resulting value. After a preliminarily set time has passed with the head part
6
completely descending, i.e., at a bottom dead center of the nozzle, the nozzle
5
rises to a regulated height, whereby one mounting cycle is finished. The cycle is repeated thereafter. Data of the aforementioned descent stroke and push-in amount are input from the operation panel
2
and controlled by the controller
1
.
The above operation will be more fully described with reference to a flow chart of FIG.
14
A. In
FIG. 14A
, a state at a descent step of the nozzle after the apparatus starts is as illustrated in (
1
) of
FIG. 14B
, followed sequentially by a push-in step in FIG.
14
B(
2
) and a nozzle ascent step shown in FIGS.
14
B(
3
) to
14
B(
4
).
In the mounting apparatus of the prior art, since the push-in amount to mount the component is constant (fixed), irregularities in height of the electronic components and irregularities in mounting height of the electronic components because of a rising or swelling solder cannot be coped with. That is, the component might be pressed too much onto the board when the component is mounted on the board, and leap up due to an elasticity of the board when the nozzle rises afterwards, as is clear from FIG.
14
B(
3
). The component
8
would eventually be displaced as shown in FIG.
14
B(
4
), or the like inconvenience of deteriorating accuracy of the component after mounting is brought about.
The present invention is devised to eliminate the above-described issue, and has for its object to provide an apparatus and a method for mounting components which can prevent displacement of the components after mounting and improve productivity.
DISCLOSURE OF INVENTION
In order to accomplish this and other objects, the present invention is constructed as follows. According to a first aspect of the present invention, there is provided a mounting apparatus for a component, which comprises:
a component holding member for holding a component and moving up and down relative to a mounting member on which the component is to be mounted;
a driving apparatus for moving the component holding member up and down; and
a control apparatus controlling the driving apparatus so that the component holding member holding the component moves down towards the mounting member, brings the held component into contact with the mounting member, moves further downward by a push-in amount, mounts the component to the member, moves up by a distance corresponding approximately to the push-in amount, stops temporarily thereby retaining the component, maintains a retaining state for a fixed time, and then moves up again.
According to a second aspect of the present invention, there is provided a component mounting apparatus according to the first aspect wherein the control apparatus receives an input of warp state information indicating a state of warp of the mounting member, and determines on the basis of the input information indicating the state of warp the push-in amount by the component holding member when mounting the component to the mounting member, so that the component is mounted on the basis of the determined push-in amount.
According to a third aspect of the present invention, there is provided a component mounting apparatus according to the first or second aspect, wherein the control apparatus receives an input of information of the push-in amount for every component, and determines on the basis of the input information of the push-in amount of the component the push-in amount by the component holding member when mounting the component to the mounting member, so that the component is mounted on the basis of the determined push-in amount.
According to a fourth aspect of the present invention, there is provided a component mounting apparatus according to any one of the first through third aspects, wherein the control apparatus receives an input of information of the push-in amount of the component based on information of a mounting position of the component relative to the mounting member, and determines on the basis of the input information of the push-in amount of the component the push-in amount by the component holding member when mounting the component to the mounting member, so that the component is mounted on the basis of the determined push-in amount.
According to a fifth aspect of the present invention, there is provided a component mounting apparatus according to any one of the first through fourth aspects, which further comprises a load detection apparatus for detecting a load acting on the component holding member or the mounting member when the component is mounted to the mounting member by the component holding member, whereby the control apparatus controls the component holding member to press in the component to the mounting member until the push-in amount obtained from the load detected by the load detection apparatus becomes a predetermined push-in amount.
According to a sixth aspect of the present invention, there is provided a component mounting apparatus according to any one of the first through fifth aspects, wherein the fixed time while the nozzle maintains the retaining state under the control by the control apparatus is a time provided for preventing the component from leaping.
According to a seventh aspect of the present invention, there is provided a component mounting apparatus according to any one of the first through sixth aspects, wherein the control apparatus controls so that the component holding member moves up at a low speed enabling prevention of a leap of the component for only a period enabling the prevention of the leap of the component, and moves up at a speed higher than the low speed after the period, in place of the arrangement that the component holding member is raised by a distance corresponding approximately to the push-in amount, temporarily stopped thereby retaining the component, maintains a retaining state for the fixed time, and rises again.
According to an eighth aspect of the present invention, there is provided a component mounting method which comprises: moving down a component holding member holding a component towards a mounting member on which the component is to be mounted;
bringing the held component in contact with the mounting member, and then lowering the component further by a push-in amount thereby mounting the com
Mimura Naoto
Nakano Tomoyuki
Obara Hirofumi
Uchiyama Hiroshi
Chang Rick Kiltae
Matsushita Electric - Industrial Co., Ltd.
Wenderoth , Lind & Ponack, L.L.P.
Young Lee
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