Heat sink

Details Heat sink Heat sink

1999-06-11

2001-01-23

Lazarus, Ira S. (Department: 3743)

Heat exchange

Heat transmitter

C165S080300, C257S722000

Reexamination Certificate

active

06176304

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention generally relates to a heat sink for removing heat from an electronic device, such as a central processing unit of a computer, and in particular, to a composite heat sink comprising an aluminum-extruded base on which a folded fin made by repeatedly folding a thin conductive plate is fixed.
2. The Prior Art
Heat sinks are used to remove heat from an electronic device, such as a central processing unit. There are two general types of heat sinks available on the market, respectively shown in
FIGS. 3A
,
3
B and FIG.
4
.
In
FIGS. 3A and 3B
, an aluminum-extruded heat sink is shown. A heat sink
100
is made by first performing an aluminum extruding process on a structure having a base
102
to form a plurality of fins
104
extending therefrom and defining air passages
106
having a depth of h
1
therebetween as shown in FIG.
3
A. The heat sink
100
is further machined by sawing the air passages
106
to a depth h
2
, as shown in
FIG. 3B
, which is greater than the original depth h
1
for increasing the total surface area of the heat sink
100
. The sawing operation is time- and labor-consuming. Furthermore, waste is generated during the sawing operation which, unless properly removed and cleaned, obstructs air flow through the passages
106
thereby reducing the heat removal rate of the heat sink
100
.
In
FIG. 4
, a folded fin heat sink
200
is shown. The folded fin
200
is made by repeatedly folding a thin conductive plate to form a number of side walls
202
connected by alternately arranged top and bottom walls
205
,
204
. A plurality of air passageways
206
are defined between adjacent side walls
202
for air to flow therethrough. The bottom walls
204
are positioned on and attached to a top face
208
of an electronic device
210
from which heat is to be removed. The attachment of the folded fin
200
to the electronic device
210
is usually done by means of an adhesive. Gaps or air voids are usually present between the bottom walls
204
and the electronic device
210
thereby reducing the heat removal rate. Furthermore, the attachment of the folded fin
200
to the electronic device
210
by means of adhesive is unreliable and the folded fin
200
may become easily detached from the electronic device
210
.
It is thus desirable to have a heat sink, which does not exhibit the disadvantages associated with conventional heat sinks.
SUMMARY OF THE INVENTION
Accordingly, an object of the present invention is to provide a heat sink which has a composite structure comprising a folded fin member mounted to an aluminum-extruded base for simplifying the manufacturing process of the heat sink while enhancing the performance thereof.
To achieve the above objects, a heat sink in accordance with the present invention comprises a base having a plurality of ribs formed thereon and defining a plurality of grooves therebetween, and a folded fin member having a plurality of side walls connected by alternately arranged top and bottom walls. The folded fin member is mounted to the base by inserting the bottom walls thereof into the grooves of the base to directly contact a top surface of the base. Thermal grease, wax, or tape is interposed between the bottom walls of the folded fin member and the top surface of the base for enhancing heat transfer therebetween. Each rib of the base has two corrugated inside faces and each side wall of the folded fin member has at least one inclined tab extending therefrom for engaging with the corresponding corrugated inside face of the ribs of the base thereby securing the folded fin member to the base.


REFERENCES:
patent: 4978638 (1990-12-01), Buller et al.
patent: 5038858 (1991-08-01), Mertol
patent: 5394299 (1995-02-01), Chu et al.
patent: 5533257 (1996-07-01), Romero et al.
patent: 5771966 (1998-06-01), Jacoby
patent: 5791406 (1998-08-01), Gonner et al.
patent: 5963795 (1999-10-01), Schneider et al.
patent: 6008536 (1991-08-01), Mertol
patent: 2502472 (1976-07-01), None

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