Component produced by micro-electrodeposition

Details Component produced by micro-electrodeposition Component produced by micro-electrodeposition

1998-09-04

2001-08-28

Dixon, Merrick (Department: 1774)

Stock material or miscellaneous articles

Structurally defined web or sheet

Including components having same physical characteristic in...

C428S220000, C428S312800, C428S209000

Reexamination Certificate

active

06280832

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to a microplated component.
BACKGROUND INFORMATION
Conventional microplated components, used in the form of perforated disks in injection valves or for the production of fine sprays in general, e.g. with large spraying angles, are already known from German Patent No. 196 07 288. The individual plates, or working layers, of the perforated disk are built upon one another by electrodeposition (multilayer electroplating). The plates are electrodeposited consecutively so that the subsequent plate adheres firmly to the underlying plate due to electrical bonding, and all layers together then form a one-piece perforated disk. To make a large number of perforated disks easier to handle when applying the various manufacturing process steps to a wafer, two positioning receptacles, e.g. in the form of circular through holes, are provided close to the outer edge of the perforated disk and extend along the entire axial height of the perforated disk. This simplifies the buildup of several electroplated layers, which takes place consecutively over time. However, the disadvantage of this is that no information revealing the outline of the perforated disk can be derived externally from the perforated disk.
European Patent No. 567 332 and German Patent No. 44 32 725 also describe microplated components that are produced by a similar technology. Viewed from the outside, the finished components in this case do not reveal any information on the layout, structure, or any other parameters of the components.
SUMMARY OF THE INVENTION
The component according to the present invention has an advantage that information about the layout and outline of the component can be easily obtained. To do this, code marks which can be very easily evaluated and decoded through optical or other means are provided while microplating the component, i.e. during the electroplating process, thereby making a great deal of information about the component parameters available.
The code marks can be produced, at no extra expense, during the production steps needed to achieve the desired component geometry, e.g. the aperture geometry of a perforated disk through which a fluid flows. A code mark is produced out of the way of the essential contours needed for performing the component functions in the very same manner as other aperture areas. The code marks are advantageously formed during the first electroplating step by using photolithography masks. As a result, the code marks are positioned from the very beginning on a side of the component forming an outer edge.
It is especially advantageous to combine several code marks into a code field. This can easily increase the amount of information contained in the encrypted code marks to a considerable degree. The code marks are advantageously provided in binary code, i.e. recesses and filled-in metal areas (voids) correspond to the numbers 0 and 1, thereby forming a binary code which can be very easily decoded.


REFERENCES:
patent: 44 32 725 (1996-01-01), None
patent: 1 96 07 288 (1996-10-01), None
patent: 567 332 (1993-10-01), None
patent: 0567332 (1996-06-01), None
patent: 63-290285 (1988-11-01), None

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