Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
1998-02-05
2001-01-09
Williams, Alexander O. (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S722000, C257S723000, C257S717000, C257S726000, C165S080300, C165S104330, C165S122000, C341S079000, C341S079000, C341S079000
Reexamination Certificate
active
06172416
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a heat sink unit for cooling a semiconductor device such as an IC and to an electronic apparatus.
2. Description of the Prior Art
Conventionally, a heat sink unit is used to cool a semiconductor producing a high temperature. Particularly, a fan-motor integrated heat sink unit having a high cooling effect in which a small fan is built in a heat sink is recently used in order to correspond to a high temperature produced by an MPU.
A conventional heat sink unit is described below.
FIG. 6
is a perspective view showing a conventional heat sink unit. In
FIG. 6
, numeral
1
denotes a substrate and a plurality of semiconductor devices
2
,
3
,
4
,
5
, and
6
are set on the substrate
1
. Numeral
7
denotes a heat sink unit which is set on a semiconductor device
6
producing a relatively large amount of heat. The heat sink unit
7
comprises a plurality of fins
8
, a fan
9
, and a motor
10
for rotating the fan
9
.
An air flow is generated by rotating the fan
9
by the motor
10
and the semiconductor device
6
is prevented from being abnormally heated by applying the air flow to the fins
8
. That is, the heat produced by the semiconductor device
6
is transmitted to the fins
8
and cooled by the air flow. Moreover, the air flow coming out of the heat sink
7
contacts the semiconductor devices
2
,
3
,
4
, and
5
to cool the semiconductor devices
2
,
3
,
4
, and
5
.
However, the above conventional heat sink unit
7
has a limit in its cooling capacity. In addition to the heat produced by the semiconductor device
6
serving as a CPU, the amount of heat produced by the semiconductor devices
2
,
3
,
4
, and
5
is increased because operation speeds of the semiconductor devices
2
,
3
,
4
, and
5
are increased (clock acceleration) and a computer having two CPUs appears. Therefore, a problem occurs that adequate cooling cannot be made only by the air flow discharged from the heat sink unit
7
.
Moreover, because electromagnetic waves are inevitably generated due to clock acceleration, a problem occurs that an action must be taken for electromagnetic waves in order to cut off unnecessary electromagnetic waves emitted from a lead
6
a
of the semiconductor device
6
.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide a heat sink unit and an electronic apparatus capable of efficiently cooling a plurality of semiconductor devices and taking action for unnecessary electromagnetic waves.
To achieve the above object of the present invention, the present invention has a plurality of fan units and electromagnetic shielding means for cutting off electromagnetic waves on a heat sink substrate.
Moreover, a function capable of controlling unnecessary electromagnetic waves emitted from a semiconductor device and the like is obtained because of using a heat sink substrate, a fan unit having a fan for supplying fluid to the heat sink substrate and driving means for rotating the fan, and electromagnetic shielding means provided for the heat sink substrate.
Furthermore, a function capable of controlling unnecessary electromagnetic waves emitted from a semiconductor device and the like is obtained by providing electromagnetic shielding means for a heat sink substrate by at least one of ways of constituting the heat sink substrate with an electromagnetic shielding material, forming a film made of the electromagnetic shielding material on the heat sink substrate, and attaching a plate made of the electromagnetic shielding material to the heat sink substrate and moreover, has a function capable of improving the productivity because the electromagnetic shielding means can be easily set.
Furthermore, a function capable of efficiently transmitting the heat discharged from semiconductor devices with different heights to a heat sink substrate is obtained by setting a sheet having at least either of elasticity and plasticity to the heat sink substrate or forming a recess on the heat sink substrate.
Furthermore, in the case of an electronic apparatus of the present invention provided with a substrate, a plurality of exothermic elements set on the substrate, and a heat sink unit set on the exothermic elements, the heat sink unit is provided with a heat sink substrate, a fan for supplying fluid to the heat sink substrate, and driving means for rotating the fan. Therefore, a function capable of securely and efficiently cooling the exothermic elements is obtained by setting the exothermic elements to the heat sink substrate and cooling the exothermic elements by one heat sink substrate and moreover, a function capable of improving the productivity is obtained because the number of parts is decreased so that the structure is simplified.
Furthermore, a function capable of improving the cooling efficiency is obtained by setting a plurality of fan units on a heat sink substrate.
Furthermore, a function capable of controlling unnecessary electromagnetic waves emitted from a semiconductor device and the like is obtained by setting electromagnetic shielding means to a heat sink substrate.
Furthermore, a function capable of improving the productivity is obtained because electromagnetic shielding means can be easily set by providing the electromagnetic shielding means for a heat sink substrate by at least one of ways of constituting the heat sink substrate with an electromagnetic shielding material, forming a film made of the electromagnetic shielding material on the heat sink substrate, and attaching a plate made of the electromagnetic shielding material to the heat sink substrate.
Furthermore, a function capable of efficiently leading the heat produced by exothermic elements with different heights to a heat sink substrate is obtained because a plurality of exothermic elements are a plurality of semiconductor devices, at least one of the exothermic elements has a setting height from the substrate different from that of other elements, and moreover means to be brought into contact with the semiconductor devices is set to the heat sink substrate.
Furthermore, a function capable of improving the productivity is obtained because a heat sink substrate can be easily brought into contact with a plurality of semiconductor devices at a low cost by setting a sheet having at least either of elasticity and plasticity to the heat sink substrate as means to be brought into contact with the semiconductor devices or forming a recess on the heat sink substrate.
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Miyahara Masaharu
Suga Kenji
Sugimoto Kazuhiko
Tada Hisao
Tate Sumio
Matsushita Electric - Industrial Co., Ltd.
Stevens Davis Miller & Mosher L.L.P.
Williams Alexander O.
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