Patent
1985-09-30
1987-12-08
Edlow, Martin H.
357 72, 357 81, H01L 2328, H01L 2504, H01L 2302
Patent
active
047121297
ABSTRACT:
A semiconductor integrated circuit device includes a rigid planar member or cover affixed to and overlying at least a portion of the upper surface of a semiconductor integrated circuit bar. The upper surface of the planar member is textured to lock the member to the encapsulating medium, and has a thermal coefficient of expansion similar to that of the integrated circuit bar. According to another aspect of the invention the planar member is formed of a material having a low alpha particle emission.
REFERENCES:
patent: 4069497 (1978-01-01), Steidlitz
patent: 4104676 (1978-08-01), Bednorz et al.
Comfort James T.
Edlow Martin H.
Limanek Robert P.
Sharp Melvin
Telecky Jr. Frederick J.
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