Multi-chip module package structure

Details Multi-chip module package structure Multi-chip module package structure

2000-08-15

2001-08-28

Ngô, Ngân V. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S707000, C257S719000, C257S723000, C257S725000

Reexamination Certificate

active

06281578

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to integrated circuit (IC) packaging technology, and more particularly, to a multi-chip module (MCM) integrated circuit package structure which can be used to pack a plurality of semiconductor chips of different functions in a single package while nonetheless allowing the overall package size to be as small as some existing types of integrated circuit packages.
2. Description of Related Art
An MCM type of integrated circuit package is designed to pack more than one semiconductor chips, typically of different functions, in a single package module. This allows a single package module to be capable of offering a system level of functionality. For example, a microprocessor chip, an SRAM (Static Random-Access Memory) chip, and a flash memory chip can be packed in the same package module, so that the package module alone can offer the functionality of a microcontroller.
Conventionally, there are many ways to pack a plurality of semiconductor chips of different functions in a single package, including, for example, the U.S. Pat. No. 5,053,852 to Biswas et al., entitled “MOLDED HYBRID IC PACKAGE AND LEAD FRAME THEREFORE”. One drawback to this patent, however, is that it is considerably large in size that makes it take a large surface mounting area on the circuit board.
SUMMARY OF THE INVENTION
It is therefore an objective of this invention to provide an MCM integrated circuit package structure, which can pack a plurality of semiconductor chips in a single package while nonetheless allowing the overall package size to be as small as some existing types of integrated circuit packages, so that it can be manufactured using the existing fabrication equipment.
In accordance with the foregoing and other objectives, the invention proposes a new MCM integrated circuit package structure for packing a plurality of semiconductor chips. The MCM integrated circuit package structure of the invention comprises: a substrate having a front surface and a back surface and formed with at least one through opening; a first semiconductor chip mounted on the front surface of the substrate; a second semiconductor chip of a central-pad type having a plurality of centrally-located bonding pads, which is mounted across the opening on the back surface of the substrate with the centrally-located bonding pads being exposed through the opening; electrically coupling means for electrically interconnecting the first semiconductor chip, the second semiconductor chip, and the substrate; a plurality of leads electrically connected to the substrate for external electrically coupling of the first and second semiconductor chips; and an encapsulation body which encapsulates the first semiconductor chip, the second semiconductor chip, and the substrate.
The foregoing MCM integrated circuit package structure can pack a plurality of semiconductor chips of different functions in a single package, while nonetheless allowing the overall package size to be the same as a conventional SO (Small Outline) package or a QFP (Quad Flat Package). Moreover, it also allows the wiring to the central-pad type semiconductor chip to be shortened.


REFERENCES:
patent: 5053852 (1991-10-01), Biswas et al.
patent: 5477082 (1995-12-01), Buckley, III et al.
patent: 5804874 (1998-09-01), An et al.
patent: 6031279 (2000-02-01), Lenz
patent: 6122171 (2000-09-01), Akram et al.
patent: 6239366 (2001-05-01), Hsuan et al.

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