Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
1998-11-18
2001-05-01
Gaffin, Jeffrey (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C029S842000, C029S843000, C174S261000
Reexamination Certificate
active
06225573
ABSTRACT:
TECHNICAL FIELD
The present invention relates to a method for installing terminals on a circuit board comprising desired electronic circuits and electrical circuits, and to a circuit board used in this method.
BACKGROUND ART
FIG. 28
shows one example of a conventional structure wherein terminals are installed on a circuit board. In the structure illustrated in this diagram, terminal
9
has a thin plate shape and is made from metal, and it comprises a connecting end
9
a
and a non-connecting end
9
b
. The connecting end
9
a
is soldered to the circuit board
1
K, whilst the non-connecting end
9
b
projects externally from the circuit board
1
K. By adopting a composition of this kind, it is possible to bend the aforementioned non-connecting end, if necessary, as indicated by the imaginary line in the diagram, and this is convenient for making the non-connecting end
9
b
into the electrode of a cell, or the terminal of a further circuit board, or the like.
Since the task of soldering the aforementioned terminal
9
to the circuit board is carried out manually by an operator, the work efficiency is poor. Therefore, conventionally, reflow soldering has been adopted as a method for soldering the aforementioned terminal
9
. This reflow soldering method comprises a step of coating solder paste onto the surface of the circuit board
1
K, a step of superimposing the aforementioned connecting end
9
a
over the region of the board coated with the solder paste, and a step of heating and melting the aforementioned solder paste, and this sequence of steps can be automated.
However, in the prior art, the following problems occur when the connecting end
9
a
is soldered to the circuit board
1
K by means of a reflow soldering method.
Namely, as shown in
FIG. 29
for example, in a case where the two end regions
9
c
,
9
d
of a terminal
9
A of a set length are superimposed on two regions
35
,
35
coated with solder paste, a self-alignment effect is obtained. This is due to the fact that when the solder paste in the aforementioned two regions
35
,
35
coated with solder paste are heated and melted, the surface tension of the molten solder acts respectively on each end region
9
c
,
9
d
, and a force aligning the whole of the terminal
9
A with the aforementioned two solder paste coated regions
35
,
35
is exhibited. In order to obtain a self-alignment effect in this way by using a reflow soldering method, it is necessary for the surface tension of the molten solder to act on the terminal at a plurality of points.
However, in the structure illustrated in
FIG. 28
, only connecting end
9
a
of the aforementioned terminal
9
is soldered to the circuit board
1
K, and therefore the surface tension of the molten solder only acts on this portion of the terminal. Therefore, in the prior art, in a case where the aforementioned terminal
9
is installed on the circuit board
1
K, a problem arises in that no self-alignment effect is obtained and therefore the positional accuracy of the-terminal
9
declines.
Conventionally, as means for raising the positional accuracy of the terminal
9
, pins for registering the location of the terminal
9
may be constructed on the circuit board
1
K. However, in the case of means of this kind, the aforementioned pins present an obstacle when installing the terminal
9
on the aforementioned circuit board
1
K, and there have been instances where automatic installation of the terminal
9
by means of an automatic mounting device has been difficult to implement. Moreover, problems have also arisen in that the task of constructing the aforementioned pins on the circuit board
1
K is complicated and the associated work cost becomes high.
DISCLOSURE OF THE INVENTION
It is an object of the present invention to provide a method for installing terminals on a circuit board, whereby the aforementioned problems can be resolved or alleviated. Moreover, it is a further object of the present invention to provide a circuit board on which the aforementioned method can be implemented appropriately.
A first aspect of the present invention is a method for installing terminals on a circuit board comprising a coating step for coating solder paste onto a desired circuit board, a superimposing step for superimposing a connecting end of a terminal also having a non-connecting end onto a region where the solder paste is coated, and a heating step for heating and melting the solder paste in order to solder the connecting end to the circuit board, characterized in that it comprises a step for coating an adhesive material on to the aforementioned circuit board, the connecting end being brought into contact with the region onto which the adhesive material has been coated in the superimposing step, and the solder paste being heated and caused to melt in a state where the connecting end is bonded to the circuit board by means of the adhesive material in the heating step.
A second aspect of the present invention is a circuit board whereon solder paste is coated for soldering a connecting end of a terminal also having a non-connecting end, characterized in that it is coated with an adhesive material, which contacts the connecting end when the connecting end is superimposed on the regions on which the solder paste is coated.
Desirably, the adhesive material is a thermosetting adhesive material which undergoes thermosetting at a lower temperature than the melting temperature of the solder paste, and in the heating step, the adhesive material undergoes thermosetting before the solder paste becomes molten.
Desirably, the adhesive material is coated onto the periphery of the solder paste coated regions, and in the superimposing step, the terminal is positioned in such a manner that the regions on which the adhesive material is coated make contact with the outer edges of the connecting end and project beyond the connecting end.
Desirably, in the superimposing step, by superimposing the whole of the terminal on the circuit board and then, after soldering of the connecting end has been completed, cutting the circuit board in the lateral direction of the terminal between the connecting end and non-connecting end, the non-connecting end is caused to project beyond the cut edge of the circuit board.
A third aspect of the present invention is a method for installing terminals on a circuit board comprising a coating step for coating solder paste onto a desired circuit board, a superimposing step for superimposing a connecting end of a terminal also having a non-connecting end onto a region where the solder paste is coated, and a heating step for heating and melting the solder paste in order to solder the connecting end to the circuit board, characterized in that an inserting section is provided in the circuit board; in the superimposing step, the terminal is fixed by inserting at least one portion of the terminal into the inserting section; and in the heating step, the solder paste is heated and caused to melt whilst the terminal is fixed by the inserting section.
A fourth aspect of the present invention is a circuit board whereon solder paste is coated for soldering a connecting end of a terminal also having a non-connecting end, characterized in that it comprises an inserting section into which at least a portion of the terminal can be inserted in such a manner that the positioning of the terminal is maintained when the connecting end is superimposed on the regions onto which the solder paste is coated.
Desirably, the inserting section is a recess section, wherein one portion of the circuit board is formed into a recessed shape by press processing.
Desirably, the inserting section is a recess section, wherein one portion of the circuit board is formed into a recessed shape by etching.
Desirably, the inserting section is a frame section formed by conducting thick film printing in a frame shape onto the circuit board.
A fifth aspect of the present invention is a method for installing terminals on a circuit board comprising: a coating step for coating solder paste onto one side of a desired
Gaffin Jeffrey
Merchant & Gould P.C.
Norris Jeremy
Rohm & Co., Ltd.
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