Substrate junction element

Details Substrate junction element Substrate junction element

1999-11-17

2001-06-12

Gandhi, Jayprakash N. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S767000, C361S784000, C174S050510, C360S097010

Reexamination Certificate

active

06246590

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a junction element for connecting wirings used in an electronic apparatus such as a magnetic disc apparatus, an optical disc apparatus or a magneto-optical disc apparatus and, in particular, to a substrate junction element capable of reliably connecting substrates differing in thickness.
2. Description of the Related Art
FIG. 5
is a partial perspective view showing a wiring junction process for a magnetic head device provided in a conventional floppy disk apparatus, and
FIG. 6
is a partial perspective view showing the construction after the connection of the wiring.
In a magnetic head device for a floppy disk apparatus, magnetic heads are symmetrically opposed to each other with the disk serving as the magnetic medium being therebetween. The magnetic head positioned above the disk is supported by a gimbal, and the magnetic head positioned below the disk is supported by a plate.
Each magnetic head is connected to a wiring substrate, which extends over a carriage
1
positioned at the rear end of the magnetic head device.
In
FIG. 5
, numeral
2
indicates the wiring substrate connected to the magnetic head positioned below the disk, and numeral
3
indicates the wiring substrate connected to the magnetic head positioned above the disk. On the wiring substrates
2
and
3
, conductive leads connected to electrode portions of the magnetic heads are formed, and these conductive leads are connected to connection land portions
2
a
and
3
a
at the rear end of the wiring substrates
2
and
3
. Further, as shown in
FIG. 5
, the wiring substrates
2
and
3
have holes
2
b
and
3
b
formed in the vicinity of the connection land portions
2
a
and
3
a.
Further, a main substrate
4
is installed on the carriage
1
. This main substrate
4
comprises a thin-film substrate
5
on which predetermined electronic parts constituting recording/reproduction circuits, etc. are mounted, and a reinforcing plate
6
joined to the back side thereof and having a fixed thickness. Formed on the thin-film substrate
5
is a conductive lead connected to the electrode portions of the electronic parts, and a part of the conductive lead extends to the forward end of the thin-film substrate
5
and is connected to connection land portions
5
a.
As shown in
FIG. 5
, a protrusion
1
a
is formed on the carriage
1
, and the protrusion
1
a
is passed through a hole
4
a
formed in the main substrate
4
, whereby the positioning of the main substrate
4
on the carriage
1
is effected.
Further, the protrusion la is passed through the holes
2
b
and
3
b
formed in the wiring substrates
2
and
3
, which are placed on the main substrate
4
, whereby the connection land portions
2
a
and
3
a
of the wiring substrates
2
and
3
are partly superimposed on the connection land portion
5
a
of the main substrate
4
.
Then, as shown in FIG.
6
. the connection land portions
2
a
and
3
a
of the upwardly exposed wiring substrates
2
and
3
and the connection land portion
5
a
of the main substrate
4
are soldered (shaded portion) to thereby effect conductive connection.
However, in the construction in which the main substrate
4
is arranged on the carriage
1
and then the wiring substrates
2
and
3
are placed thereon to solder the connection land portions
2
a
and
3
a
of the wiring substrates
2
and
3
to the connection land portions
5
a
of the main substrate
4
, the connection land portions
2
a
and
3
a
are apt to rise from the connection land portions
5
a
of the main substrate
4
due to warpage, etc. of the wiring substrates
2
and
3
.
Thus, it is necessary to solder the connection land portions
2
a
and
3
a
to the connection land portions
5
a
while pressing the wiring substrates
2
and
3
to the surface of the main substrate
4
by using a tool such as a pair of tweezers, with the result that the soldering operation is very difficult. Further, when the wiring substrates
2
and
3
rise during or immediately after the soldering operation, the solder between the connection land portions is broken or separated, with the result that defective soldering,.is likely to occur.
SUMMARY OF THE INVENTION
The present invention has been made for the purpose of solving the above problem in the conventional technique. Accordingly, it is an object of the present invention to provide a substrate junction element in which rising of the wiring substrate due to warpage or the like is prevented, thereby making it possible to reliably solder the connection land portions of the main substrate and the wiring substrates.
In accordance with the present invention, there is provided a substrate junction element comprising a main substrate having on its surface a wiring portion on which electronic parts are mounted and in its edge portion a connection land portion, a flexible wiring substrate having a connection land portion connected to the main substrate and a conductive lead connected to the connection land portion and adapted to connect the electronic parts to other electronic function portions, and a relay member having a support surface supporting the connecting portion of the main substrate and the wiring substrate,
wherein the wiring substrate is installed on the support surface, wherein the main substrate is placed on the wiring substrate so that the connection land portion of the main substrate is adjacent thereto, and wherein connection land portion of the wiring substrate and the connection land portion of the main substrate are soldered to each other.
Further, it is desirable that a positioning portion be formed on the support surface which is fitted into the wiring substrate to effect the positioning of the wiring substrate.
When there are a plurality of wiring substrates, it is desirable that the positioning of each wiring substrate be effected by the common positioning portion, and that the main substrate be placed on the plurality of wiring substrates.
In the present invention, an end portion of a wiring substrate which connects an electronic part to an electronic function portion and which has a smaller width and is longer than a main substrate is installed on a support surface, and a relatively wide main substrate on which the electronic part is mounted is placed on the wiring substrate to be superimposed thereon. Thus, the end portion of the wiring substrate where the connection land portion is formed does not rise from the support surface. In particular, the connection land portions of the wiring substrate and the main substrate can be reliably soldered to each other without having to press the wiring substrate against the main substrate.
The positioning portion is a protrusion provided on the relay member, and a recess or a hole into which the protrusion is to be fitted are formed in the wiring substrate and the main substrate. By effecting positioning by using this positioning portion, the positioning of the connection land portions of the two substrates can be effected such that soldering can be conducted.
In particular, the main substrate consists of a laminate which comprises a thin-film substrate on which electronic parts are mounted and on which a connection land portion is formed, and a reinforcing plate supporting this thin-film substrate. It is desirable that the thin-film substrate protrude beyond the edge portion of the reinforcing plate, and that this protruding thin-film substrate be placed on the wiring substrate on the support surface.
In this case, the relay member can be provided with a step portion forming a portion lower than the support surface, the portion of the main substrate having the reinforcing plate being positioned at the lower portion, and the thin-film substrate protruding from the edge portion of the reinforcing plate being placed on the support surface.
Further, it is desirable that the reinforcing plate and the relay member being fastened by adhesion to each other in the lower portion.
In the above-mentioned means, the thin-film substrate extending f

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