IC card having circuit modules for mounting electronic component

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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Details

361401, 361406, 235492, H05K 702

Patent

active

050180517

ABSTRACT:
An IC card is disclosed which comprises a card-shaped main substrate having a surface on which recess portions are formed and an edge portion having a connector layer with an external connector terminal pattern formed thereon, circuit modules embedded in the recess portions in main substrate, each module having electronic components including IC chips, a chip capacitor and a thin D.C. battery unit, and a double-layered wiring structure for providing electric connection between the electronic components and the connector terminal pattern. The double-layered wiring structure comprises a first wiring layer formed on the main substrate to cover the circuit modules and a second wiring layer formed insulatively above the former wiring layer. The first wiring layer has a first wiring pattern that extends in a first direction of the main substrate to be coupled to the electronic components. The second wiring layer has a second wiring pattern that extends in a second direction of the main substrate to be coupled to the first wiring pattern and the connector terminal pattern.

REFERENCES:
patent: 4616655 (1986-10-01), Weinberg et al.
patent: 4635356 (1987-01-01), Ohuchi et al.
patent: 4733061 (1988-03-01), Hegi
patent: 4754319 (1988-06-01), Saito et al.
patent: 4755661 (1988-07-01), Ruebsam
M. Ohuchi et al., "A New LSI Interconnection Method for IC Cards" IEEE Trans. Components, Hybrids, Manuf. Technol., vol. CHMT-10, No. 3; pp. 310-313 Sep. 1987.

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