Plasma reactor chuck assembly

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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Details

156643, 156646, 204298, C23F 102, B44C 122, C03C 1500

Patent

active

045472475

ABSTRACT:
A plasma reactor of the single wafer, planar electrode type achieves improved serviceability by means of a service seal arrangement. The lower electrode of the plasma reactor is carried on a chuck. Both the chuck and the upper portions of the reactor seal to an upper plate of a vacuum containment vessel. A wafer transport mechanism is contained within the vacuum containment vessel. The sealing arrangement allows removal of the upper portions of the reactor and even replacement of the lower electrode without disturbing the vacuum in the vacuum containment vessel.

REFERENCES:
patent: 4209357 (1980-06-01), Gorin et al.
patent: 4318767 (1982-03-01), Hijikata et al.
patent: 4340462 (1982-07-01), Koch
patent: 4341582 (1982-07-01), Kohman et al.

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