Method of mounting semiconductor elements

Details Method of mounting semiconductor elements Method of mounting semiconductor elements

1993-02-02

1994-09-20

Bradley, P. Austin

Metal fusion bonding

Process

Plural joints

29841, 257796, 257722, B23K 3102, H05K 334

Patent

active

053482140

ABSTRACT:
A method of mounting a plurality of semiconductor elements each having bump electrodes on a wiring board by pressing the semiconductor elements to the wiring board while aligning the electrodes and heating the structure. In the mounting method, one or more heat sinks are previously joined to the backs opposite to the surfaces with the bump electrodes formed thereon of the semiconductor elements.

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