Power transistor module packaging structure

Details Power transistor module packaging structure Power transistor module packaging structure

1997-07-31

1999-08-31

Thompson, Gregory

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257719, 257727, 361690, 361715, H05K 720

Patent

active

059461926

ABSTRACT:
An apparatus which secures a heat sink to an electrical component connected to a circuit board, including a first outer cover which engages a portion of the heat sink and a portion of the circuit board. In addition, the first outer cover encloses the electrical component, and the electrical component has at least two pins, a first surface facing the circuit board, and a second surface facing the heat sink. Further, a majority of heat dissipating surfaces of the heat sink are outside a space enclosed by the first outer cover and the circuit board.

REFERENCES:
patent: 4621304 (1986-11-01), Oogaki et al.
patent: 5339215 (1994-08-01), Nishiguchi
patent: 5740013 (1998-04-01), Ruejner et al.
Neumann et al, IBM Tech Discl. Bulletin "Removable Cap for Modules" vol. 24, No. 9 Feb. 1982 pp. 4635-4636. 361/715.

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