Manufacturing method for an electronic component

Coating processes – Electrical product produced

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Details

428421, 427 79, 2281802, 228214, 228215, B05D 512

Patent

active

047088850

ABSTRACT:
A manufacturing method for an electronic component connected at a lead terminal thereof to electrodes at an element so that the element is coated at the surface with an over-coat resin, which prevents the lead terminal from being unnecessarily coated with the over-coat resin, thereby improving the automatic insertion efficiency of the electronic component with respect to a printed circuit board.
An intermediate portion of the lead terminal positioned at the outer peripheral edge of the element is previously applied with a repellent against the over-coat resin, the lead terminal being mounted on the element and thereafter the element being dipped into the over-coat resin, so that the over-coat resin, when coated on the element, is prevented from adhering to the portion of lead terminal applied with the repellent, thereby avoiding creation of running of the over-coat resin at the lead terminal.

REFERENCES:
patent: 2710266 (1955-06-01), Hochberg
patent: 2772186 (1956-11-01), Mollers
patent: 3736179 (1973-05-01), De Gier
patent: 4273803 (1981-06-01), Johnk
patent: 4385081 (1983-05-01), Keller
patent: 4505982 (1985-03-01), Hoheisel
patent: 4511076 (1985-04-01), Roth

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