Semiconductor wafer testing apparatus using intermediate semicon

Details Semiconductor wafer testing apparatus using intermediate semicon Semiconductor wafer testing apparatus using intermediate semicon

1994-10-14

1995-07-18

Wieder, Kenneth A.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324754, G01R 104

Patent

active

054345138

ABSTRACT:
Bump electrodes are formed on the bottom surface of an intermediate semiconductor wafer at locations corresponding to electrode pads of circuit elements formed on a subject semiconductor wafer. Pickup electrodes and control electrodes are formed on the top surface of the intermediate semiconductor wafer. A switching circuit is formed in the intermediate semiconductor wafer, and serves to connect selected ones of the bump electrodes to the pickup electrodes in accordance with switching control signals provided from a tester via the control electrodes. The pickup electrodes and the control electrodes are connected to the tester via pogo pins.

REFERENCES:
patent: 4038599 (1977-07-01), Bove et al.
patent: 5034685 (1991-06-01), Leedy
patent: 5172050 (1992-12-01), Swapp
patent: 5177438 (1993-01-01), Littlebury et al.

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