Patent
1988-12-13
1989-08-22
Hille, Rolf
357 70, H01L 2348
Patent
active
048600873
ABSTRACT:
The present invention relates to a semiconductor device and a process for producing the same. The principal surface of a semiconductor pellet is provided with a plurality of first bonding pad electrodes arranged in a first arrangement state and a plurality of second bonding pad electrodes which are provided with substantially the same electric circuit functions as those of the corresponding first bonding pad electrodes and which are arranged in a second arrangement state that is different from the first arrangement state. By virtue of the above-described means, it is possible to connect together pad electrodes and mating external terminals of a mounting substrate in the same way regardless of whether the pellet is mounted according to the face-up or face-down method. Accordingly, it is unnecessary to prepare different kinds of pellet having individual pad arrangements which conform with respective mounting methods, and it is possible to cope with a multiplicity of different kinds of mounting method with one kind of pellet.
REFERENCES:
patent: 3591839 (1971-07-01), Evans
patent: 4124864 (1978-11-01), Greenberg
patent: 4143385 (1979-03-01), Miyoshi et al.
patent: 4736236 (1988-04-01), Butt
patent: 4800418 (1989-01-01), Natsui
Kawashimo Norishige
Kihara Toshimasa
Matsubara Kiyoshi
Yamaura Tadashi
Hille Rolf
Hitachi , Ltd.
Le Hoang-anh
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