Epoxy resin composition

Details Epoxy resin composition Epoxy resin composition

1988-03-16

1989-08-22

Bleutge, John C.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523427, 523435, 523436, 523428, 523429, 523445, 523457, 523466, 525476, 528 27, 528 29, C08L 6300

Patent

active

048597228

ABSTRACT:
An epoxy resin composition which comprises a curable epoxy resin, a hardener, and a block copolymer formed by the reaction of a triphenol-alkane type resin or a polymer thereof with a specific organopoly-siloxane. The composition provides a cured product having a high glass transition point, a low coefficient of expansion, good crack resistance, and is less likely to exert stress to the semiconductor devices. It exhibits distinct characteristics when used as a sealing compound for semiconductor devices, especially in the case where the element is bonded directly to a printed circuit board or heat sink. It is very unlikely that a semiconductor device sealed with it would become warped.

REFERENCES:
patent: 3407169 (1968-10-01), Johnson et al.
patent: 4720515 (1988-01-01), Iji et al.

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