Method for manufacturing semiconductor device with leads adhered

Details Method for manufacturing semiconductor device with leads adhered Method for manufacturing semiconductor device with leads adhered

1987-11-30

1989-08-22

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437206, 206330, 357 70, 357 80, 357 81, H01L 2348

Patent

active

048596140

ABSTRACT:
A semiconductor device comprising: a semiconductor chip; a package for accommodating the chip; groups of leads which are arranged around the perimeter of the package; and strip; insulators, such as plastic films, to each of which one of the groups of leads are adhered. In addition, a method for manufacturing the device, comprising the steps of: preparing a package including a semiconductor chip and having lead frames each of which is composed of leads and a supporting end portion; adhering the lead frames to an insulating sheet such as a plastic film; and clipping off the portions of the insulating sheet to which the supporting end portions are adhered.

REFERENCES:
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patent: 4115837 (1978-09-01), Beall et al.
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patent: 4215359 (1980-07-01), Schermer et al.
patent: 4259436 (1981-03-01), Tabuchi et al.
patent: 4554404 (1985-11-01), Gilder, Jr. et al.
patent: 4600611 (1986-07-01), Clark

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