Radiation imagery chemistry: process – composition – or product th – Diazo reproduction – process – composition – or product – Composition or product which contains radiation sensitive...
Patent
1989-12-28
1992-05-19
Lovering, Richard D.
Radiation imagery chemistry: process, composition, or product th
Diazo reproduction, process, composition, or product
Composition or product which contains radiation sensitive...
252600, 522 39, 522 47, 522 50, 430197, 430270, C08F 246, C08G 7314, C08J 328, G03C 152
Patent
active
051148269
ABSTRACT:
New photosensitive polyimide compositions and processes of using the same in the fabrication of electronic components are provided. These compositions are comprised of ##STR1## containing polyamic acids and/or the corresponding hydroxy-polyamic esters, or hydroxypolyimides and a photoactive component as an additive or as covalently bonded functionality on the polymer chain. These compositions provide positive or negative patterning options and may be used as conventional resist materials, as imageable dielectric or passivating layers, as high Tg ion implant masks or as imageable lift-off layers in the fabrication of multilevel metal structures.
REFERENCES:
patent: 4631245 (1986-12-01), Pawlowski
patent: 4912018 (1990-03-01), Osuch et al.
patent: 4927736 (1990-05-01), Mueller et al.
patent: 4942108 (1990-07-01), Moreau et al.
Kwong Ranee W.
Sachdev Harbans S.
Sachdev Krishna G.
IBM Corporation
Lovering Richard D.
Stemwedel John A.
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