Wafer segment separator and method

Details Wafer segment separator and method Wafer segment separator and method

1987-10-26

1989-01-17

Dawson, Robert A.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156584, 198461, B32B 3118

Patent

active

047986450

ABSTRACT:
An apparatus for removing segments of a wafer adhering to an upper surface of a flat flexible carrier. The apparatus comprises a base supporting a separator plate disposed between a cassette-type conveyor and a support plate. The separator plate has a separator edge spaced apart from the conveyor to form a narrow gap. A take-up drum is rotatably mounted within the base and has a clamping member capable of gripping the leading edge of the flexible carrier. When the take-up drum is rotated by a powering mechanism the carrier is drawn along the support surface and into the narrow gap between the separator plate and conveyor. The carrier is framed to ensure that the carrier maintains its configuration during operation of the apparatus. The powering mechanism that rotates the take-up drum simultaneously actuates the conveyor. Thus, as the carrier is drawn into the narrow gap the segments of the wafer and the frame are peeled from the carrier and deposited onto the conveyor. Guides on the conveyor lift the frame to prevent contact of the frame with the wafer segments. The separator plate and support plate are at a descending angle of 4.degree. as measured from the edge of the conveyor adjacent the narrow gap.

REFERENCES:
patent: 3562057 (1971-02-01), McAlister et al.
patent: 3606035 (1971-09-01), Gantley
patent: 4273606 (1981-06-01), Trilli
patent: 4475969 (1984-10-01), Reed

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