Electronic device packaging arrangement

Details Electronic device packaging arrangement Electronic device packaging arrangement

1979-05-21

1981-03-24

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361387, 174 52PE, H05K 720

Patent

active

042584116

ABSTRACT:
The subject electronic device packaging arrangement is designed to enhance heat transfer from an electronic device to the printed circuit board to which it is attached. This is accomplished by employing a thermally conductive base having a depression in the top thereof into which the electronic device is placed and bonded. The base has a protuberance in the bottom thereof corresponding to the depression in the top, which protuberance is attached to the associated printed circuit board. The protuberance on the base is formed to be in contact with the printed circuit board surface to provide thermal dissipation into the board by conduction processes. Continuous or segmented conductors are bonded both to the electronic device and to the base. These conductors are bent over the edge of the base to the bottom of the base where they align with corresponding contact points on the printed circuit board.

REFERENCES:
patent: 3689804 (1972-09-01), Ishihama
patent: 3859570 (1975-01-01), Veranth
patent: 3930114 (1975-12-01), Hodge
patent: 3936928 (1976-02-01), Hopp
patent: 4037270 (1977-07-01), Ahmann
patent: 4079511 (1978-03-01), Grabbe
patent: 4103321 (1978-07-01), Gansert
Internal Thermal Design of LSI Package, Chu, IBM Tech. Discl. Bull., vol. 19, No. 12, May 1977, p. 4690.

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