Method of mounting interrelated components

Details Method of mounting interrelated components Method of mounting interrelated components

1980-10-01

1983-02-01

Husar, Francis S.

Electricity: electrical systems and devices

Miscellaneous

29840, 228180A, 357 75, 361400, H05K 334, H05K 118

Patent

active

043719120

ABSTRACT:
One specially designed fixture allows two components such as a microprocessor and its associated ROM to be simultaneously mounted on opposite surfaces of the substrate, with all or nearly all internal connections made through the area of the substrate between the components. A second fixture allows for wave soldering lead frames to the assembly while protecting the reflow soldered components. The method thus provides the most direct connections between the two components with all internal connections and external connections made by two automatic operations. A third component can be positioned astraddle the mounted assembly for minimum lead lengths.

REFERENCES:
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"High-Density Packaging Goes Denser with QUIPs and Square-Chip Carriers", Morris Grossman, Electronic Design 6, 3/15/79.
Innovations in Hybrid Packaging, by H. Markstein in Electronic Packaging & Production, Sep. 1979, pp. 41-44.

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