Etching a substrate: processes – Nongaseous phase etching of substrate – Using film of etchant between a stationary surface and a...
Patent
1995-12-29
1997-07-08
Breneman, R. Bruce
Etching a substrate: processes
Nongaseous phase etching of substrate
Using film of etchant between a stationary surface and a...
216 88, 1566361, 252 791, 106 6, C09G 100, B24B 100
Patent
active
056457367
ABSTRACT:
A method is shown for polishing a workpiece such as a semiconductor wafer. A polishing composition is first formed which includes (1) a polishing media particle; and (2) a film forming binder for suspending the particle and forming a temporary film on an exposed surface of the workpiece, the temporary film being dissolvable in a subsequently applied polishing wash, whereby the polishing media particle is freed to polish the workpiece. The polishing composition is applied to the surface of the semiconductor wafer in a spin coating operation and thereafter cured in a hot plate bake or a furnace operation. In order to polish the workpiece, a polishing wash is applied to either or both of the surface of the workpiece or a polishing pad and thereafter causing the pad to be sufficiently proximate to the surface of the workpiece at a pressure and for a time sufficient to polish and planarize the workpiece.
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Adjodha Michael E.
Bailey Wayne P.
Breneman R. Bruce
Gunter Jr. Charles D.
Symbios Logic Inc.
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