Substrate having at least one fine-wired conductive layer

Details Substrate having at least one fine-wired conductive layer Substrate having at least one fine-wired conductive layer

1984-03-09

1986-06-10

Grimley, Arthur T.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

427 96, 427125, 428901, H05K 109

Patent

active

045944733

ABSTRACT:
A fine-wired conductor for use in LSI circuits exhibits good adhesion properties. The conductor is made up of a film of metal such as chrome or titanium on an insulator such as a ceramic substrate, a gold layer over the film of metal and a palladium film on the gold layer. In addition, a palladium layer can be interposed between the metal film and the gold layer to facilitate gold plating and inhibit diffusion of the metal and the gold.

REFERENCES:
patent: 3576722 (1971-04-01), Fennimore et al.
patent: 3634159 (1972-01-01), Croskery
patent: 4031272 (1977-06-01), Khanna
patent: 4068022 (1978-01-01), Glick
patent: 4226932 (1980-10-01), Ferraris
patent: 4281057 (1981-07-01), Castellani et al.
Berry et al., "Thin Film Technology", pp. 146-149, 1968 Princeton, N.J.
IBM Technical Disclosure Bulletin, "High Structure . . . Wiring", vol. 24, No. 12, May 1982, Archey et al.
Feinstein et al., "Performance of . . . Environment", IEEE Transactions . . . Technology", vol. CHMT-2, No. 2, Jun. 1979, pp. 159-171.

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