Polishing apparatus

Abrading – Machine – Rotary tool

Patent

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Details

451288, 451289, 451390, 451398, 451384, B24B 500, B24B 2900

Patent

active

056454732

ABSTRACT:
A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a reduced height compared with conventional polishing apparatuses. The height reduction is achieved by disposing a drive motor for rotating a top ring below a turntable, and by making a swing shaft for loading/unloading of the workpiece hollow to accommodate a rotating shaft for transmitting rotation from the motor to the top ring.

REFERENCES:
patent: 4450652 (1984-05-01), Walsh
patent: 5317837 (1994-06-01), Stahli
patent: 5421769 (1995-06-01), Schultz et al.
patent: 5456627 (1995-10-01), Jackson et al.
patent: 5486265 (1996-01-01), Salugsugan
patent: 5536202 (1996-07-01), Appel et al.
patent: 5542874 (1996-08-01), Chikaki

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