Membrane mask for selective semiconductor etching

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156 17, 156212, 156216, 156247, 156286, 156344, 156382, 156475, H01L 750

Patent

active

039606236

ABSTRACT:
Disclosed is a method for selectively etching portions of the surface of a semiconductor body. Selected regions of the surface which are not to be etched are covered with a pliable membrane such as a plastic sheet that conforms to the shape of the body and forms a seal with the body. The combination of the membrane and body is then exposed to an etchant which only contacts the exposed portions of the body. Conformity of the membrane can be enhanced by any of several methods.
For example, heat can be applied to make the membrane more pliable, a vacuum can be drawn between the membrane and the body or mechanical pressure can be applied to urge the membrane against the body. The aforementioned conformity enhancement steps are used during the covering operation, either individually or in combination.

REFERENCES:
patent: 3130101 (1964-04-01), Gittins et al.
patent: 3323967 (1967-06-01), Webb
patent: 3371001 (1968-02-01), Ettre
patent: 3499805 (1970-03-01), Brooks
patent: 3519506 (1970-07-01), Topas

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