SiC sintered body having metallized layer and production method

Details SiC sintered body having metallized layer and production method SiC sintered body having metallized layer and production method

1983-06-16

1987-05-05

James, Andrew J.

357 81, 357 80, 357 74, H01L 2302, H01L 2306, H01L 2308, H01L 2314

Patent

active

046636498

ABSTRACT:
A metallized layer formed on a SiC sintered body essentially consists of a metal conductor such as Cu or Au as its principal component and a binder such as phosphorous alloy, the oxide of which forms a vitreous material together with a silicon oxide formed previously on the surface of the SiC sintered body, the metallized layer is bonded to the SiC sintered body through a fused vitreous layer of a composite oxide formed during sintering of the metallized layer in an oxidizing atmosphere, the fused vitreous layer of the composite oxide essentially consists of the silicon oxide and the oxides of the binder.
The metallized layer exhibits an improved wettability to solders.

REFERENCES:
patent: 2937324 (1960-05-01), Kroko
patent: 3121829 (1964-02-01), Huizing et al.
patent: 3201666 (1965-08-01), Hall
patent: 4352120 (1982-09-01), Kurihara et al.
patent: 4517584 (1985-05-01), Matsushita et al.

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