Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
Patent
1985-09-30
1988-09-27
Pellinen, A. D.
Electricity: electrical systems and devices
Electrostatic capacitors
Fixed capacitor
361386, 357 82, 174 16HS, H02B 100
Patent
active
047746300
ABSTRACT:
Apparatus for mounting a semiconductor device chip and making electrical connections thereto is disclosed. A semiconductor device chip has its backside connected to the surface of a substrate, and its upper surface includes a plurality of electrical pads across the entire surface thereof. A translator chip having a plurality of first electrical contacts disposed generally across the interior portion thereof are in electrical contact with the semiconductor device chip electrical pads, and a plurality of second electrical contacts disposed generally around the perimeter of the translator chip are electrically connected with the electrical terminals in the substrate to which the chip is attached. Heat may be removed from the semiconductor device chip through its backside via cooling channels in the substrate.
REFERENCES:
patent: T955008 (1977-02-01), Gregor et al.
patent: 3325882 (1987-06-01), Chiou et al.
patent: 3428866 (1969-02-01), Chiou et al.
patent: 3436604 (1969-04-01), Hyltin et al.
patent: 3706010 (1972-12-01), Laermer et al.
patent: 3871014 (1969-08-01), King et al.
patent: 3871015 (1969-08-01), Lin et al.
patent: 3946428 (1976-03-01), Anazawa et al.
patent: 3959579 (1967-05-01), Johnson
patent: 3984620 (1976-10-01), Robillard et al.
patent: 3984739 (1976-10-01), Mochizuki et al.
patent: 4030001 (1977-06-01), Medley, Jr. et al.
patent: 4092697 (1976-12-01), Spaight
patent: 4150420 (1979-04-01), Berg
patent: 4246597 (1979-06-01), Cole et al.
patent: 4323914 (1979-02-01), Berndlmaier et al.
patent: 4398208 (1983-08-01), Marano et al.
patent: 4484215 (1984-11-01), Pappas
patent: 4591537 (1986-05-01), Aldinger et al.
"IC Package Assembly", J. D. Larnerd, IBM Technical Disclosure Bulletin, May 1978, vol. 20, No. 12, S8796-003.
Hwang Lih-Tyng
Narayan Jagdish
Osburn Carlton M.
Reisman Arnold
Jennings Derek S.
Microelectronics Center of North Carolina
Pellinen A. D.
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