Low weight multilayer printed circuit board

Details Low weight multilayer printed circuit board Low weight multilayer printed circuit board

1995-04-03

1997-04-08

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174262, 361791, 439 82, H05K 102

Patent

active

056190182

ABSTRACT:
A multilayer printed circuit board comprising conducting layers of a first material and conducting layers of a second material includes noncorrosive low resistance electrical contacts between conducting layers of the first and second material. The noncorrosive low resistance contacts allow the use of light weight conducting materials for particular layers of the circuit board to produce a light weight multilayer circuit board.

REFERENCES:
patent: 2795770 (1957-06-01), Toedtman
patent: 2872391 (1959-02-01), Hauser et al.
patent: 2969517 (1961-01-01), Gluck
patent: 3305416 (1967-02-01), Kahan et al.
patent: 3312870 (1967-04-01), Rhoades
patent: 3317652 (1967-05-01), Johannessen et al.
patent: 3446908 (1969-05-01), Tally et al.
patent: 3516156 (1970-06-01), Steranko
patent: 3519959 (1970-07-01), Bewley et al.
patent: 3524960 (1970-08-01), Lohff
patent: 3781596 (1973-12-01), Galli et al.
patent: 3821692 (1974-06-01), Barnard
patent: 3827004 (1974-07-01), Vanden Heuvel et al.
patent: 3829601 (1974-08-01), Jeannotte et al.
patent: 3875479 (1975-04-01), Jaggar
patent: 3880486 (1975-04-01), Avakian
patent: 3927841 (1975-12-01), Iacobucci
patent: 4181396 (1980-01-01), Olashaw
patent: 4562301 (1985-12-01), Kameda et al.
patent: 4591220 (1986-05-01), Impey
patent: 4591659 (1986-05-01), Leibowitz
patent: 4610756 (1986-09-01), Strobel
patent: 4633035 (1986-12-01), McMonagle
patent: 4663208 (1987-05-01), Ninomiya et al.
patent: 4679122 (1987-07-01), Belke, Jr. et al.
patent: 4681655 (1987-07-01), Potter
patent: 4691078 (1987-09-01), Nishioka et al.
patent: 4691971 (1987-09-01), Hahn
patent: 4755911 (1988-07-01), Suzuki
patent: 4784707 (1988-11-01), Wefers et al.
patent: 4786523 (1988-11-01), Dohya
patent: 4830691 (1989-05-01), Kida et al.
patent: 4906198 (1990-03-01), Cosimano et al.
patent: 5015207 (1991-05-01), Koepke
patent: 5072075 (1991-12-01), Lee et al.
patent: 5097390 (1992-03-01), Gerrie et al.
patent: 5129142 (1992-07-01), Bindra et al.
patent: 5130882 (1992-07-01), Hilland
patent: 5183404 (1993-02-01), Aldous et al.
patent: 5217478 (1993-06-01), Rexroth
patent: 5224017 (1993-06-01), Martin
patent: 5236772 (1993-08-01), Horikoshi et al.
patent: 5281771 (1994-01-01), Swift et al.
patent: 5301420 (1994-04-01), Cho et al.
patent: 5348792 (1994-09-01), Hattori et al.
patent: 5362359 (1994-11-01), Horikoshi et al.
patent: 5372872 (1994-12-01), Funada et al.
patent: 5487684 (1996-01-01), Sohalk et al.

Affiliated with

Also associated with

Rating

Low weight multilayer printed circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low weight multilayer printed circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low weight multilayer printed circuit board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2398975