Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1995-09-27
1997-04-08
Tentoni, Leo B.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156238, 26417314, 26417315, 26417319, 2642105, 2642106, 2642107, 26421112, 2642358, B29C 4706, B32B 2718, B32B 3130
Patent
active
056183690
ABSTRACT:
The invention relates to a matte multilayer polypropylene film which includes at least one base layer containing polypropylene and migrating additives or a mixture of migrating additives, and at least one outer layer which includes a mixture or a blend of two components I and II. Component I essentially contains a propylene homopolymer or a copolymer of ethylene and propylene or ethylene and butylene or propylene and butylene or ethylene and another .alpha.-olefin having 5 to 10 carbon atoms or propylene and another .alpha.-olefin having 5 to 10 carbon atoms or a terpolymer of ethylene and propylene and butylene or ethylene and propylene and another .alpha.-olefin having 5 to 10 carbon atoms or a mixture of two or more of said homopolymers, copolymers and terpolymers or a blend of two or more of said homopolymers, copolymers and terpolymers, if desired mixed with one or more of said homopolymers, copolymers and terpolymers. Component II essentially contains an HDPE or a blend of two components A and B. Blend component A is essentially an HDPE. Blend component B is essentially a propylene homopolymer or a copolymer of ethylene and propylene or ethylene and butylene or propylene and butylene or ethylene and another .alpha.-olefin having 5 to 10 carbon atoms or propylene and another .alpha.-olefin having 5 to 10 carbon atoms or a terpolymer of ethylene and propylene and butylene or ethylene and propylene and another .alpha.-olefin having 5 to 10 carbon atoms or a mixture of two or more of said homopolymers, copolymers and terpolymers or a blend of two or more of said homopolymers, copolymers and terpolymers. The film has use in a metallization process.
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Murschall Ursula
Peiffer Herbert
Hoechst Aktiengesellschaft
Tentoni Leo B.
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