Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
Patent
1991-10-25
1993-01-05
Thompson, Gregory D.
Electricity: electrical systems and devices
Electrostatic capacitors
Fixed capacitor
361386, 257714, H05K 720
Patent
active
051776677
ABSTRACT:
A thermal conduction module for cooling an array of integrated circuit chips mounted on a substrate includes a moveable piston for cooling the chips, the piston having a base, urged against an upper surface of the chips, of thermally conductive material. The base has on the lower surface thereof cups or channels between adjacent rows of the chips, and, on the upper surface thereof, parallel channels directly over the chips. The piston includes members extending downward into the upper surface channels for directing a flow of coolant into the upper surface channels and impinging the coolant on the channel bottoms. The flow directing members may be plate-like baffles or nozzles. The piston also includes passages for directing coolant from one upper surface channel to an adjacent upper surface channel in a flow direction perpendicular to the axes of the upper surface channels.
REFERENCES:
patent: 3524497 (1968-04-01), Chu et al.
patent: 4138692 (1979-02-01), Meeker et al.
patent: 4494171 (1985-01-01), Bland et al.
patent: 4574877 (1986-02-01), Klein
patent: 4686606 (1987-08-01), Yamada et al.
patent: 4758926 (1988-07-01), Herrell et al.
patent: 4882654 (1989-11-01), Nelson et al.
patent: 4920574 (1990-04-01), Yamamoto et al.
patent: 4962444 (1990-10-01), Niggemann
patent: 4964458 (1990-10-01), Flint et al.
patent: 4977443 (1990-12-01), Kobayashi et al.
patent: 4977444 (1990-12-01), Nakajima et al.
patent: 5023695 (1991-06-01), Umezawa et al.
patent: 5050037 (1991-09-01), Yamamoto et al.
Damm, Jr., IBM Tech Disclosure Bulletin, "Convection Cooling Apparatus", vol. 20, No. 7, Dec. 1977, pp. 2755-2756.
IBM Technical Disclosure Bulletin, vol. 20, No. 10 (Mar. 1978) pp. 3898-3899.
Graham Nadia H.
Moran Kevin P.
Ahsan Aziz M.
International Business Machines - Corporation
Peterson Peter W.
Thompson Gregory D.
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