Lead wire array for a leadless chip carrier

Details Lead wire array for a leadless chip carrier Lead wire array for a leadless chip carrier

1991-10-21

1993-01-05

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

29829, 29842, 29832, 174261, 361404, 361405, 361406, 257693, H01L 2302, H01R 900, H05K 300, H05K 330

Patent

active

051773260

ABSTRACT:
A lead wire array for a leadless chip carrier which functions to mount and electrically interconnect a leadless chip carrier to a printed wiring board. The array is formed from a length of bare wire which is appropriately folded and bent to provide interconnections between the contact pads on the leadless chip carrier and contact pads on the printed wiring board, which are then separated by removing portions of the lead wire array after its attachment to the leadless chip carrier.

REFERENCES:
patent: 3689684 (1972-09-01), Cox, Jr. et al.
patent: 4089575 (1978-05-01), Grabbe
patent: 4647126 (1987-03-01), Sobota, Jr.
patent: 4736520 (1988-04-01), Morris
patent: 4991666 (1991-02-01), Septfons et al.
patent: 5099396 (1992-03-01), Barz et al.

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