Chemistry of carbon compounds – Miscellaneous organic carbon compounds
Patent
1979-12-21
1981-08-04
Michl, Paul R.
Chemistry of carbon compounds
Miscellaneous organic carbon compounds
260 296PM, C08F 836
Patent
active
042821304
ABSTRACT:
The present invention relates to a process for forming a polymeric solution or gel having a viscosity of at least about 50,000 cps which includes the steps forming a solvent system of an organic liquid and a polar cosolvent, the polar cosolvent being less than about 15 wt. % of the solvent system, a viscosity of the solvent system being less than about 1000 cps; dissolving a neutralized sulfonated polymer in the solvent system to form a solution, a concentration of the neutralized sulfonated polymer in the solution being about 0.1 to about 20 wt. %, a viscosity of the solution being less than about 20,000 cps; and adding about 5 to about 500 vol. % water to the solution having viscosity less than about 20,000 cps, the water being immiscible with the solution and the polar cosolvent transferring from the solution phase to the water phase thereby causing the viscosity of said solution to increase from less than 20,000 cps to greater than 50,000 cps.
REFERENCES:
patent: 2809959 (1957-10-01), Roth
patent: 2813087 (1957-11-01), Roth
patent: 3554287 (1971-01-01), Eilers
patent: 3870841 (1975-03-01), Makowski
patent: 3888945 (1975-06-01), Arndt
patent: 4157432 (1979-06-01), Lundberg
patent: 4226751 (1980-10-01), Lundberg
Klein Robert R.
Lundberg Robert D.
Makowski Henry S.
O'Brien Dennis E.
Exxon Research & Engineering Co.
Michl Paul R.
Nanfeldt Richard E.
LandOfFree
Process for controlled gelation of polymeric solution (C-669) does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for controlled gelation of polymeric solution (C-669), we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for controlled gelation of polymeric solution (C-669) will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-239239