Method of manufacturing a ceramic carrier

Details Method of manufacturing a ceramic carrier Method of manufacturing a ceramic carrier

1990-07-09

1993-01-05

Lowe, James

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

264 61, 264 66, C04B 3700, B32B 3126

Patent

active

051767732

ABSTRACT:
A method of manufacturing a ceramic substrate with improved mounting pad location tolerances. The method begins with a green non-dimensionally stable ceramic base 10 to which at least one conductive layer 15, 16 such as a tungsten mixture is screen printed. The tungsten layer locationally defines a pattern including pads 15. This composite assembly is subsequently stabilized as in firing and a second insulating ceramic slurry layer with openings 29 located over the relative larger pads is screen printed on the stabilized composite assembly. This method eliminates tolerances in final mounting pad location due to unpredictable shrinkage and yet maintains excellent mounting pad adhesion since the entire pad overlays some portion of the tungsten pad.

REFERENCES:
patent: 4641425 (1987-02-01), Dubuisson et al.
patent: 5006182 (1991-04-01), Gantzhorn, Jr. et al.
patent: 5028473 (1991-07-01), Vitriol et al.

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