Interdigitated leads-over-chip lead frame, device, and method fo

Details Interdigitated leads-over-chip lead frame, device, and method fo Interdigitated leads-over-chip lead frame, device, and method fo

1999-03-18

1999-12-28

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361820, 257672, 257666, 257786, 257686, H05K 502

Patent

active

060089962

ABSTRACT:
An inventive Leads-Over-Chip (LOC) lead frame includes an assembly of interdigitated leads constructed to overlie double-sided adhesive tape on the front-side surface of an integrated circuit (IC) die. An attachment surface of each lead is adhesively attachable to the tape, and at least some of the leads are constructed to extend across the front-side surface of the die from one edge substantially to another edge, such as an adjacent or opposing edge. As a result, a substantial area of the front-side surface of the die is adhesively attachable to the leads through the tape, so the die is supportable in an IC package in an improved manner, and the heat may be conducted away from the die through the lead frame in an improved manner.

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