Electroplating process and composition

Details Electroplating process and composition Electroplating process and composition

1993-08-09

1994-12-20

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

205210, 205159, 427 97, 427307, 427424, 156666, C25D 534, C25D 554

Patent

active

053743466

ABSTRACT:
A process of electroplating comprising formation of a semiconductive coating over an article having both metallic and non-metallic portions, dissolving the metal surface underlying the semiconductive coating and removing the semiconductive coating by a high pressure water spray. The process is useful for the formation of printed circuit boards.

REFERENCES:
patent: 5007968 (1991-04-01), Cobbman et al.
patent: 5207888 (1993-05-01), Bladon

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