Method and apparatus providing redundancy for fabricating highly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

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257773, 361684, 365244, H01L 2166, H01L 2144

Patent

active

06008538&

ABSTRACT:
A method and apparatus for repair of a multi-chip module such as a memory module is provided, where at least one redundant or auxiliary chip attach location is provided on the substrate of the multi-chip module. The auxiliary chip attach location preferably provides contacts for attachment of more than one type of replacement semiconductor chip. Accordingly, when one or more chips on the multi-chip module are found to be completely or partially defective, at least one replacement chip can be selected and attached to the auxiliary location to provide additional memory to bring the module back to its design capacity.

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