Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1997-03-25
1998-10-20
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
H01R 909
Patent
active
058237941
ABSTRACT:
An IC pressing mechanism in an IC socket comprises a cover mounted in such a way to be able to move upwardly and downwardly with respect to a socket body, an IC pressing lever movable between a pressing position and a releasing position with respect to an IC package in accordance with upward and downward movement of the cover, such that, in the pressing position, the IC pressing lever urges an IC lead against a contact on a socket body, and a transmission lever for linking the cover and the IC pressing lever together. The transmission lever is connected at an upper end side thereof to the cover through a pin and rotatable inwardly and is outwardly about the pin. A lower end side of the transmission lever and an outer end side of the IC pressing lever are connected together through a pin. When the transmission lever are lowered in accordance with lowering of the cover, the pin connection portion between the lower end side of the transmission lever and the outer end side of the IC pressing lever is restricted in such a way to be caused to move downwardly and outwardly at the same time, and a pressing portion on an inner end of the IC pressing lever is caused to move upwardly and outwardly at the same time by the downward and outward movement of the pin connection portion.
REFERENCES:
patent: 5658153 (1997-08-01), Ikeya et al.
patent: 5697795 (1997-12-01), Abe
patent: 5752846 (1998-05-01), Abe
Abrams Neil
Standig Barry M. L.
Yamaichi Electronics Co. Ltd.
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