Process for reducing the interdiffusion of conductors and/or sem

Metal treatment – Compositions – Heat treating

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357 65, 428672, H01L 2946, B32B 1504, H01L 21283

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active

042820430

ABSTRACT:
The interdiffusion at the interface between a metallic-type conductor or semiconductor and a second metallic-type conductor or semiconductor in intimate contact therewith due to elevated temperatures is reduced by subjecting a surface of at least one of the materials when at an elevated temperature to a gas which contains at least one component which changes the surface potential and work function of the surface which is subjected to the gas in a direction according to the relative electronegativities of the materials.

REFERENCES:
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patent: 4065588 (1977-12-01), Arnold
patent: 4110488 (1978-08-01), Risko
patent: 4172906 (1979-10-01), Pancholy
C. A. Chang, J. Electrochem. Soc. 127 (1980) 1331.
C. A. Chang et al., Appl. Phys. Letts. 37 (1980) 161.
Ohkawa et al., Japan J. Appl. Phys. 14 (1975) 1589.
Hiraki et al. J. Appl. Phys. 43 (1972) 3643.
Ho et al., IBM-TDB, 21 (1978) 1752.

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