Microcircuit device metallization

Details Microcircuit device metallization Microcircuit device metallization

1977-06-27

1978-09-12

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204192R, 357 71, 427 92, C25D 502, C25D 712, C25D 554, C23C 1500

Patent

active

041135784

ABSTRACT:
Contact electrodes and electronic device interconnection pathways are formed by sputtering and by deposition methods supplemented by plating. These may be formed, for example, on integrated circuit wafers or mounting substrates.

REFERENCES:
patent: 3408271 (1968-10-01), Reissmueller et al.
patent: 3479269 (1969-11-01), Byrnes, Jr. et al.
patent: 3737380 (1973-06-01), Bachmeier
patent: 3761309 (1973-09-01), Schmitter et al.

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