Method and apparatus for rapid curing of epoxy adhesive in secur

Details Method and apparatus for rapid curing of epoxy adhesive in secur Method and apparatus for rapid curing of epoxy adhesive in secur

1998-07-17

1999-12-28

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1562755, 1562757, 1563798, 1563809, 360104, B32B 3128, G11B 548

Patent

active

06007664&

ABSTRACT:
A method is disclosed for curing epoxy adhesive between the slider head and load/gimbal suspension assemblies of a disk drive access actuator employing a concentrated pulsed heat source rather than conventional, broadly applied heat source as employed in the past, such as oven heating or UV exposure. The laser source power is delivered via an optical fiber to the slider air-bearing surface (ABS) of the slider head assembly so that with this approach, the time for curing can be minimized and accurately controlled without causing damage to the assembly, and the overall curing step in the manufacturing process is reduced in time of application. Apparatus in the form of a fixture, such as an anvil element, provides a convenient gauge and support for alignment of the laser output beam with the slider ABS to which the heat for curing is to be applied as well as provide for its heat sinking.

REFERENCES:
patent: 5491597 (1996-02-01), Bennin et al.
patent: 5504640 (1996-04-01), Hagen
patent: 5537269 (1996-07-01), Zarouri
patent: 5638234 (1997-06-01), Hagen

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