Method and apparatus for cutting an ingot

Details Method and apparatus for cutting an ingot Method and apparatus for cutting an ingot

1997-07-16

1999-12-28

Rose, Robert A.

Stone working

Sawing

Endless

125 1601, 125 1602, 451 60, 451446, B24D 108

Patent

active

060067381

ABSTRACT:
A method for cutting an ingot with a wire. The method includes the steps of moving a wire in a lengthwise direction and contacting an ingot with the moving wire. The method also includes the step of supplying an abrasive slurry containing cutting oil and abrasive particles having an average diameter of about 13 .mu.m to about 15 .mu.m to the ingot when the ingot and the wire are contacting. This results in the ingot being cut with the wire and abrasive particles.

REFERENCES:
patent: 4246003 (1981-01-01), Regler et al.
patent: 5201305 (1993-04-01), Takeuchi
patent: 5269285 (1993-12-01), Toyama et al.
patent: 5387331 (1995-02-01), Ahern et al.
patent: 5628301 (1997-05-01), Katamachi
patent: 5799643 (1998-09-01), Miyata et al.
European Patent Office Patent Abstract of Japan, Publication No. 02262955, entitled "Method of Cutting Ingot by Wire Saw", Oct. 25, 1990.
European Patent Office Patent Abstract of Japan, Publication No. 03239507, entitled "Cutting Method for Si Ingot by Wire Saw", Oct. 25, 1991.

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