Metal working – Method of mechanical manufacture – Electrical device making
Patent
1992-11-10
1994-06-28
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
29828, 174 35R, 174260, 174261, 257684, 437209, 437211, 437217, 361760, H05K 100, H05K 334
Patent
active
053235339
DESCRIPTION:
BRIEF SUMMARY
An object of the present invention is a method of producing coaxial connections for an electronic component encapsulated in a package. A further object of the invention is a package comprising such connections.
In the present application, the term electronic component is understood to mean any discrete component or any integrated or hybrid circuit usable in electronics.
The increase in the speed of components and the rise in their working frequency which are currently observed mean that the links between components now have to be engineered, furthermore, in terms of energy propagation.
In particular, in order to avoid any signal reflection, the impedance of the propagation medium of this signal must be constant. However, although it is known how to achieve this for a package, it is noticeable that this is not the case for the links both of the package with the printed circuit on which it is mounted, and of the package with the component: in fact, parasitic reflections of part of the energy are experimentally observed at these sites.
The present invention makes it possible to avoid these difficulties by using coaxial lines formed collectively after wiring for the input/output connections of the component and/or of the package.
More precisely, the component, placed in a package, is conventionally connected by wire to its package; the wires are next covered by a first insulating layer, then by a second conducting layer, in such a way that this second layer is linked to the earth pads of the package, the layers thus forming coaxial-structure electrical connections with the wires. A similar process is carried out for the input/output connections of the package.
Other objects, features and results of the invention will emerge from the following description, illustrated by the attached drawings, which represent:
FIG. 1, a sectional view of a component conventionally encapsulated in a package, itself transferred to a printed circuit;
FIGS. 2a, 2b and 2c, various steps of a first embodiment of the method according to the invention, applied to the inputs/outputs of the component;
FIGS. 3a, 3b, 3c and 3d, various steps of another embodiment of the method according to the invention, still applied to the inputs/outputs of the component;
FIG. 4, an embodiment of the method according to the invention applied to the input/output connections of the package.
On these various figures, the same references refer to the same elements. Moreover, the real scale has not been adhered to, for the clarity of the drawings.
FIG. 1 thus represents a sectional view of an electronic component conventionally encapsulated in a package, itself transferred to a printed circuit.
The component indexed CI is arranged, for example by soldering or bonding, onto a base E, which is itself covered by a cap C: the base E and cap C assembly forms a package B, hermetically encapsulating the component CI. The base E is, for example, made of ceramic and comprises, for example, three layers: a first layer 11, bearing the component CI covered by a layer 12 annularly surrounding the component CI, then by a layer 13 also annularly surrounding the component but set back with respect to the layer 12, the cap being arranged on the layer 13.
On this figure are further shown connection wires F linking the input/output pads (not shown) of the component to pads of the package which are situated on one of the layers of the base, for example the layer 12 on the figure. Pins indexed P are also represented, forming the input/output connections of the package and allowing the latter to be electrically linked to one or more external circuits, typically by the intermediary of a substrate S such as a printed circuit. The pins P are conventionally linked to the pads of the package by metallised tracks and holes, which are also not shown.
FIGS. 2a, 2b and 2c represent various steps of a first embodiment of the method according to the invention, applied to the inputs/outputs of the component CI. In these various figures, only the part of FIG. 1 concerned by the connection of a
REFERENCES:
patent: 3698082 (1972-10-01), Hyltin et al.
patent: 4417392 (1983-11-01), Ibrahim et al.
patent: 4483067 (1984-11-01), Parmentier
patent: 4776087 (1988-10-01), Cronin et al.
patent: 4959900 (1990-10-01), de Givry et al.
IBM Technical Disclosure Bulletin vol. 27, No. 3, Aug. 1984 p. 1682 by M. P. Bourgeois et al.
"Thomson-CSF"
Arbes Carl J.
Plottel Roland
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