Method for forming interior bond pads having zig-zag linear arra

Details Method for forming interior bond pads having zig-zag linear arra Method for forming interior bond pads having zig-zag linear arra

1995-06-05

1996-10-22

Fourson, George

Fishing, trapping, and vermin destroying

437206, 437217, 437220, 257666, 257692, 257737, 257779, 257780, H01L 2160

Patent

active

055676553

ABSTRACT:
A technique for reducing thermally-induced mechanical stresses on bond pads in semiconductor device assemblies is accomplished by grouping (laying out) the bond pads in two parallel rows, approximately centered about a central axis of the die. Further, the bond pads of one row are axially offset from the bond pads of the other row, thereby forming a two-row zig-zag linear configuration of bond pads. The "axis" is a line preferably passing through a thermal centroid of the die. By keeping the bond pad layout close to the axis, lateral thermally-induced displacements of the bond pads relative to the axis can be minimized and controlled. Longitudinal (axial) displacements of the bond pads are accommodated by flexing, rather than compression, of conductive lines (such as leadframe fingers) connecting to the bond pads and entering the die perpendicular to the axis. By providing a staggered double-row configuration, a larger number of bond pads may be accommodated than could be accommodated in a single row, linear configuration of bond pads.

REFERENCES:
patent: 3429040 (1969-02-01), Miller
patent: 3811186 (1974-05-01), Larnerd et al.
patent: 3871014 (1975-03-01), King et al.
patent: 3984860 (1976-10-01), Logue
patent: 4190855 (1980-02-01), Inoue
patent: 4701999 (1987-10-01), Palmer
patent: 4772936 (1988-09-01), Reding et al.
patent: 4774635 (1988-09-01), Greenberg et al.
patent: 4803546 (1989-02-01), Sugimoto et al.
patent: 4825284 (1989-04-01), Soga et al.
patent: 4894704 (1990-01-01), Endo
patent: 4897602 (1990-01-01), Lin et al.
patent: 4916519 (1990-04-01), Ward
patent: 4926241 (1990-05-01), Carey
patent: 4970575 (1990-11-01), Soga et al.
patent: 5051813 (1991-09-01), Schneider et al.
patent: 5068712 (1991-11-01), Murakami et al.
patent: 5086018 (1992-02-01), Conru et al.
patent: 5227661 (1993-07-01), Heinen
patent: 5358904 (1994-10-01), Murakami et al.
patent: 5384487 (1995-01-01), Rostoker et al.
patent: 5453583 (1995-09-01), Rostoker et al.
"LED Array Modules by New Technology Microbump Bonding Method", by Hatada et al., IEEE Transactions on Comp., Hybrids, and Manuf. Tech., vol. 13, No. 3, pp. 521-527, Sep. 1990.
R Tummala, et al. "Microelectronics . . . Handbook", Van Nostrand Reinhold, 1989, pp. 366-367.

Affiliated with

Also associated with

Rating

Method for forming interior bond pads having zig-zag linear arra does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for forming interior bond pads having zig-zag linear arra, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming interior bond pads having zig-zag linear arra will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2358499