Process for the fabrication of a vertical contact

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156643, 156648, 20419234, 20419237, 427 38, 427259, 427265, 427270, 437 56, 437 61, 437176, 437177, 437178, 437188, 437192, 437193, 437200, 437201, 437203, 437228, 437229, 437233, 437239, 437243, 437915, 437985, B05D 512

Patent

active

048512575

ABSTRACT:
A process for the formation of a compact vertical contact having reduced lateral space requirements yet compatible with highly planarized semiconductor manufacturing processes. The contact is made from a foundation region having a top surface to an overlying layer separated from the foundation region by a dielectric. The overlying layer can be contacted on its edge rather than on its top surface in order to reduce the lateral expanse of the contact.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process for the fabrication of a vertical contact does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for the fabrication of a vertical contact, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for the fabrication of a vertical contact will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2357302

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.