Method of treating silicon nitride film formed by plasma deposit

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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427 531, 427 541, 427 94, 20415715, B05D 306

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046364005

ABSTRACT:
A method of treating a silicon nitride film formed by plasma deposition and deposited on a substrate, which comprises: (1) irradiating the silicon nitride film, and (2) heating the silicon nitride film during the irradiating.

REFERENCES:
patent: 4181751 (1980-01-01), Hall et al.
patent: 4229502 (1980-10-01), Wu et al.
patent: 4277320 (1981-07-01), Beguwala et al.
patent: 4469715 (1984-09-01), Madan
patent: 4495218 (1985-01-01), Azuma et al.

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