Rod assembly for manufacturing large wafer for electronic device

Details Rod assembly for manufacturing large wafer for electronic device Rod assembly for manufacturing large wafer for electronic device

1989-10-30

1992-04-14

Hille, Rolf

Fishing, trapping, and vermin destroying

357 0, 357 40, 357 85, 437249, H01L 29161, H01L 2904, H01L 2702, H01L 21461

Patent

active

051052547

ABSTRACT:
The rod assembly for wafers comprises a plurality of rods, made of materials to be used as the wafers used for electronic devices which are assembled in parallel and bonded with each other into an integrated body. Wafers used for electronic devices can be obtained by slicing the rod assembly for the wafers. Mirror-finished bonded face is formed to the outer surface for each of the rods. The bonded face to each of the rods is cleaned by a surface treatment using chemicals. Subsequently, respective rods are assembled in parallel and brought into contact with each other at their respective bonded faces. The thus prepared rods are maintained in a heated atmosphere into an integrated body. Then, the rod assembly is applied with slicing for providing wafers used for electronic devices. Since the rod assembly has a structure in which a plurality of the rods are assembled in parallel and bonded with each other into an integrated body, the diameter for the rod assembly can remarkably be increased. Accordingly, the diameter of the wafers obtained by slicing the rod assembly is also increased remarkably. Since the wafer diameter is increased remarkably, the cost per one electronic device formed on the wafer is also reduced remarkably.

REFERENCES:
patent: 4632884 (1986-12-01), Skikatami et al.
VLSI Fabrication Principles, Silicon and Gallium Arseaide Sorab K. Ghandhi, 1982.
Semiconductor Devices, Physics and Technology S. M. Sle, 1985.
M. Shimbo et al., "Silicon-to-Solicon Direct Bonding Method", J. Appl. Phys. 60(8), Oct. 15, 1986, pp. 2987-2989.
Nikkei Microdevices, Mar. 1988, pp. 82-98.

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