Stamped and formed heat sink

Details Stamped and formed heat sink Stamped and formed heat sink

1995-10-10

1996-10-22

Leo, Leonard R.

Heat exchange

With retainer for removable article

Electrical component

165122, 165185, 165125, 174 163, 257722, 361697, F28F 700, F28F 1312

Patent

active

055667490

ABSTRACT:
A stamped and formed heat sink has a thermally conductive body including a base having a face adapted for attachment to an electronic device package. Stamped and formed heat dissipation elements extend from the edges of the base perpendicular to the base. The heat sink is formed in a progressive punch and die press so that a heat sink is produced on every stroke.

REFERENCES:
patent: 3212569 (1965-10-01), McAdam
patent: 4481525 (1984-11-01), Calabro et al.
patent: 4611238 (1986-09-01), Lewis et al.
patent: 4720771 (1988-01-01), Horton
patent: 4884331 (1989-12-01), Hinshaw
patent: 5251101 (1993-10-01), Liu
patent: 5299632 (1994-04-01), Lee
patent: 5309983 (1994-05-01), Bailey
patent: 5367433 (1994-11-01), Blomquist
AMP Low Insertion Force (LIF) PGA Socket for Intel 486 DX2 CPU Device, Supplement 65238, Issued Apr. 1992.
TCM.RTM.: Thermalloy Cooling Modules, Nov. 1991, Thermalloy Inc.
New Product Bulletin, "Heat Sink for INTEL 80486 and 80860 89-DS/233-6 (C)" 1989 Thermalloy, Inc.
Thermalloy Heat Sinks for ECL and CMOS, 91-DS/GA-5.

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