Printed circuit board and method of preparing it

Details Printed circuit board and method of preparing it Printed circuit board and method of preparing it

1972-10-17

1976-01-06

Lanham, C. W.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

29588, 29627, 264272, 317101C, 317101CC, H05K 328, H05K 118

Patent

active

039314545

ABSTRACT:
A printed circuit board is prepared by connecting electronic components to the circuit, coating the board with a layer up to about 0.1 mil thick of a compound of the formula C.sub.n F.sub.2n.sub.+1 C.sub.m X.sub.2m.CHY--OOC--C(R)=CH.sub.2 or its prepolymer, replacing at least one of the electronic components, thermally bonding another electronic component to the circuit, and recoating the area around the new component with a layer of the compound or its prepolymer. In the formula n is 2 to 9, m is 1 to 9, X and Y are H, F Cl, or Br and R is --H or --CH.sub.3. This method enables a printed circuit board to be easily repaired since the coating on the board can be soldered or welded through without first removing the coating or protecting the surrounding coating.

REFERENCES:
patent: 2877544 (1959-03-01), Gammel
patent: 3377699 (1968-04-01), Dinella et al.
patent: 3652333 (1972-03-01), Warren
patent: 3682698 (1972-08-01), Palmer et al.
patent: 3693252 (1972-09-01), Robertson et al.
Licari and Brands, "Organic Coatings," Machine Design, May 25, 1967, pp. 176-194.

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