Process of manufacturing an electrical bonding interconnect havi

Details Process of manufacturing an electrical bonding interconnect havi Process of manufacturing an electrical bonding interconnect havi

1993-12-13

1996-01-02

Fourson, George

Fishing, trapping, and vermin destroying

22818022, H01L 21288, H01L 2160

Patent

active

054808340

ABSTRACT:
A process for manufacturing a low contact resistance electrical bonding interconnect having a metal bond pad portion and conductive epoxy portion. The conductive epoxy portion comprises a metal oxide reducing agent for reducing oxides formed during the fabrication of the bonding interconnect.

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patent: 3871014 (1975-03-01), King et al.
patent: 3871015 (1975-03-01), Lin et al.
patent: 4582724 (1986-04-01), Cooper
patent: 5029585 (1991-07-01), Lieber et al.
patent: 5196371 (1993-03-01), Kulesza et al.
patent: 5384284 (1995-01-01), Doan et al.
Tummala, Rao R. & Rymaszewski, Eugene J., "Microelectronics Packaging Handbook", Jan. 1, 1989, pp. 366-391, Van Nostrand Reinhold.

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